TSV 3D RF Integration - High Resistivity Si Interposer Technology (True ePUB)

TSV 3D RF Integration : High Resistivity Si Interposer Technology (True ePUB)



https://CourseWikia.com

English | 2022 | ISBN: 0323996027 | 294 Pages | True ePUB | 73 MB

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed nstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed nstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

udp://tracker.torrent.eu.org:451/announce

udp://tracker.tiny-vps.com:6969/announce

http://tracker.foreverpirates.co:80/announce

udp://tracker.cyberia.is:6969/announce

udp://exodus.desync.com:6969/announce

udp://explodie.org:6969/announce

udp://tracker.opentrackr.org:1337/announce

udp://9.rarbg.to:2780/announce

udp://tracker.internetwarriors.net:1337/announce

udp://ipv4.tracker.harry.lu:80/announce

udp://open.stealth.si:80/announce

udp://9.rarbg.to:2900/announce

udp://9.rarbg.me:2720/announce

udp://opentor.org:2710/announce